HONOR he officially announced HONOR Robot Phonea device defined by the company as “revolutionary and pioneer of a new product category. Robot Phone wants rewrite the concept of mobile shooting integrating a 3-axis motorized mechanical gimbal directly inside the body. First announced in 2025, the terminal combines complex hardware engineering with ARRI Image Science know-how, and aims to transform the smartphone into an autonomous filming station for creators and videomakers.
HONOR Titanium Agile Gimbal 4 degrees of freedom (4DoF) is the cornerstone of the system: built with over 100 precision components, the mechanism uses a titanium motor weighing just 2.6 grams capable of rotating up to 360° per second, supported by the secondary HONOR Super Steel Flip Motor with a torque density of 120 Nm/L. Compared to traditional external solutions, the size reduction is 65%, compared to a declared increase in structural resistance of 200%.
The photographic sector hinges on a 200 MP 1/1.28 inch Agile Gimbal main sensor with f/1.6 aperture, flanked by a 200 MP periscopic telephoto lens (1/1.4 inch, 2.7x optical zoom) and a 50 MP ultra-wide angle unit with a 122° field of view. Processor integration HONOR H1 Image Chip It allows data processing in the 14-bit 4:4:4 RAW domain and native support for the 10-bit ARRI LogC3 profile. The algorithm’s intervention reduces video noise by 8 dB, extending the dynamic range up to 14 stops, ensuring full compatibility with the ARRI Wide Gamut 3 color pipeline for direct import into DaVinci Resolve.
Robotic integration, Snapdragon 8 Elite Gen 5 and silicon-carbon battery
The interface MagicOS takes advantage of the dynamic capabilities of the mechanical arm to offer shooting modes such as Tilt Lock, First Person View and AI SpinShot. Through the YOYO Robot Mode function, the system combines subject tracking and orientation towards the sound source to keep the user in the center of the frame without manual intervention.
Gesture commands allow you to govern arm movement remotely, while the system agent performs complex operations between applications thanks to the Agent Skills architecture. From a hardware point of view, the terminal adopts the Snapdragon 8 Elite Gen 5 SoC flanked by a dedicated cooling system.
The metal unibody shell contains a 7,060 mAh HONOR Silicon-carbon batterycompatible with 120W wired fast charging and 50W wireless charging. The front panel is a 6.31-inch LTPO OLED managed by HONOR NanoCrystal Shield glass, with variable frequency from 1 to 120 Hz, peak brightness up to 6,800 nits and PWM dimming at 4,320 Hz.
On the Chinese market, the price list starts at 9,999 RMB (approximately €1,285) for the 12 GB + 512 GB variant and reaches 12,999 RMB (approximately €1,671) for the 16 GB + 1 TB version, with availability set from 18 August 2026.
