There HONOR Win2 range prepares for official debutscheduled for next October 21st. While waiting for the launch, the first definitive confirmations on the hardware platform come directly from the Geekbench database, the results of which were initially shared by a leaker on the X platform.
The data that emerged outlines the profile of a very high-end terminal. The tested device, identified by the model number BRM-AN00, is powered by the new chip Qualcomm Snapdragon 8 Elite Extreme Gen 6. The prototype in question is also equipped with 16 GB of RAMwhile on the software front the native presence of Custom Android 17 with the proprietary interface MagicOS 11 of Honor.
We remind you that HONOR has recently unveiled the Magic 9 series for the Chinese market. As far as Europe is concerned, however, we will have to wait a few more months. The launch it is scheduled for January 2027.
Test results on Geekbench 6
The performances recorded by the new hardware show scores of absolute importance:
- In the CPU test (carried out on Geekbench version 6.7.1), the terminal scored 4,141 points in single-core mode And 11,514 points in multi-core;
- In a separate test dedicated specifically to GPUagain on the Geekbench 6 suite, the device achieved a score of 34,695 points.
The adoption of the Snapdragon 8 Elite Extreme Gen 6 follows one logic of continuity compared to the first HONOR Winwhich debuted on the market equipped with the previous Snapdragon 8 Elite Gen 5.
The hardware configuration of the parallel model remains to be defined, theHONOR Win2 RT: It is currently unconfirmed whether the company will opt for the new standard Snapdragon 8 Elite Gen 6 or whether it will use last year’s Gen 5.
